TSMC 3Q07 Update
Revenues for the 3Q 2007 touched $2.7 billion up by around $400 million compared to 2Q 2007. Total shipments for the period were 2.2 million units (all 8†wafers now). Shipments for the quarter were up by around 20%. 66% of the quarter’s production was consumed by fabless/system customers while IDMs consumed the remaining 34%.
Geographically North America accounted for majority of the sales: 74%. Asia followed in sales with 13% of total. Europe accounted for 10% of the sales. Japan contributed 3% of the sales.
Communications segment continues to be major sales contributor segment for TSMC. In 3Q 2007, around 42% of the sales came from this segment. Other segments contributing to the quarter revenues were Computer 32%, Consumer 17%, Memory 5% and others 4%. In terms of chip technology, 0.15/0.18um contributed 28% of the revenues. That was followed closely by 90nm chips contributing 27%. The 0.11/0.13um, 0.25/0.35um, 65nm and 0.50um+ contributed 22%, 11%, 7% and 5% in that order.
During the period, TSMC started production of 0.13 micron Embedded Flash Process. These mainly fit into wireless applications operated by single, button-size batteries. Among customers, Microsoft announced integration of TSMC 90nm embedded DRAM process for Xbox 360. Another significant development during the quarter was partnering with Analog Devices for using 65nm technology in ADI’s SoftFone baseband processors.
During the quarter TSMC also increased the stake in Vanguard. This will strengthen its eight-inch wafer strategy.
