Revenues for the 4Q 2007 touched $2.96 billion up by around $260 million compared to 3Q 2007. Total shipments for the period were 2.36 million units (all 8” wafers now). Shipments for the quarter were up by around 5.9%. In 3Q 2007, the revenues had increased by 17% and the shipments by 20% which in this quarter has considerably gone down to 5.5% and 5.9% respectively. 68% of the quarter’s production was consumed by fabless/system customers while IDMs consumed the remaining 32%.
Geographically North America accounted for majority of the sales: 79%. Asia followed with 11% of total. Europe accounted for 8% of the sales. Japan contributed 2% of the sales.
Communications segment continues to be major sales contributor segment for TSMC. In 4Q 2007, communications chip contribution remained flat at 42% of the sales. Other segments contributing to the quarterly revenues were Computer 35% (up 3%), Consumer 15% (down 2%), Memory 3% (down 2%) and others 5% (up 1%).
In terms of chip technology, 90nm chips were the maximum revenue contributors for the quarter by fetching 29% of the revenues. In the quarter TSMC also announced shipping of one-millionth 12” 90nm wafer in less than 5 years. That was followed closely by 0.15/0.18um chips contributing 27%. The 0.11/0.13um, 0.25/0.35um, 65nm and 0.50um+ contributed 20%, 10%, 10% and 4% in that order. By chip technology 90nm chips saw some increase while others had a dip or remained flatter.
TSMC announced development of the first 32nm technology supporting both analog and digital functionality which will have wide usage in communications space particularly at end device side where both are used. In the quarter NetLogic Microsystems announced collaboration with TSMC on 55nm semiconductor process technology for NetLogic’s advanced knowledge-based processors. It also announced first multi-layer mask service (MLM) for 90, 80 and 65nm advanced process technologies. Qualcomm announced the first call made on a 3G chip manufactured with 45nm process technology provided by TSMC
It signed a contract with Atmel for purchasing its 8” wafer fabrication equipment from its fab in North Tyneside, UK for US$82 million.
The company also appointed Maria Marced as President of TSMC Europe.
