Infineon 1Q08 Update
Communication Solution segment generated $472 million, down 15% compared to the prior quarter and up 27 % year-over-year. Mobile phone business acquired from Texas Instruments resulted in increase in revenue y-o-y in this segment, during this quarter.
Infineon achieved a landmark in this quarter by integrating Wi-Fi on its mobile phone platform and by offering Voice-over-IP functionality for low-cost mobile phones.
Among its announcements during the quarter, Infineon announced its RF switches shipments that are manufactured in a CMOS-based process on silicon wafers. In the first quarter, for low cost mobile market, Infineon introduced X-GOLD113 and X-GOLD213 with advanced features like camera, mobile internet and audio-entertainment.
During the quarter, a Tier 1 handset company selected Infineon Technologies’s SMARTiUE+, single chip Receive-diversity transceiver IC with a standard DigRF V3.09 interface, for their HSxPA/ EDGE products. At the same time, it marketed low cost platform family in 65 nanometer as well as two new integrated and power-efficient members of its Mobile TV IC family.
