Global Communications Chip Market 2008 Update

Published: April 2008

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Executive Summary

1.          Communications Chip Market Size  

1.1        Revenues and Shipments

1.2        Core and CPE Chips

1.3        Market Leaders

2.         Trends in Communications Chip Market

2.1        Choice of Platform

2.2        Changing Business Models

2.3        Trends in Product Features

2.4        Trends in Product Design

2.5        Marketing and Distribution

2.6        Competition from Startups  

2.7        Mergers and Acquisitions 

2.8        Financing and IPOs

2.9        Legal Battles

3.          Challenges Faced by the Industry            

3.1        Size Versus Power Trade Off    

3.2        Functionality Versus Cost  

3.3        Upgradeability Requirements

3.4        Value Addition and Customer Retention

3.5        Competing Visions and Lack of Clarity

4.         Communications Chip Segment Analysis    

4.1        Broadband

4.2        802.11x and Bluetooth

4.3        Cellular

4.4        VoIP

4.5        Optical

4.6        General Networking

5.         Individual Company Analysis

5.1        Analog Devices

5.2        Broadcom

5.3        Cavium

5.4        Conexant

5.5        Freescale

5.6        Ikanos

5.7        Infineon

5.8        Integrated Device Technology

5.9        Intersil

5.10      Lattice Semiconductors

5.11      LSI

5.12      Marvell

5.13      Maxim IC

5.14      Mindspeed

5.15      NXP

5.16      PMC-Sierra

5.17      Qualcomm

5.18      Silicon Labs

5.19      Texas Instruments

5.20      Zarlink Semiconductor  

Figures and Tables

Figures

E.1: Communication Chip revenues in 2007

1.1: Communication Chip revenues in 2007

1.2: Communication Chip shipments in 2007

1.3: Chip revenue distribution by core and CPE communication devices in 2007

1.4: CPE Chip revenues for 2007

1.5: Core Chip revenues for 2007

1.6: Chip Shipment Distribution by Core and CPE Equipment in 2007

1.7: CPE chip shipments in 2007

1.8: Core chip shipments in 2007

1.9: Revenue share of Top 5 Communication Chip vendors in 2007

1.10: Revenue share of Top 5 Communication Chip vendors in 2007

4.1: Chip revenues by communication segment in 2007

4.2: Chip Shipment Distribution by communication segment in 2007

4.3: Chip Revenue Distribution by segments in Core Devices in 2007

4.4: Chip Shipment Distribution by segments in Core Devices in 2007

4.5: Chip Revenue Distribution by segments in CPE Devices in 2007

4.6: Chip Shipment Distribution by segments in CPE Devices in 2007

4.7: Revenue share of Top 5 Broadband Chip vendors in 2007

4.8: Shipment share of Top 5 Broadband Chip vendors in 2007

4.9: Revenue share of Top 5 802.11x/Bluetooth Chip vendors in 2007

4.10: Shipment share of Top 5 802.11x/Bluetooth Chip vendors in 2007

4.11: Revenue share of Top 5 Cellular Chip vendors in 2007

4.12: Shipment share of Top 5 Cellular Chip vendors in 2007

4.13: Revenue share of Top 5 VoIP Chip vendors in 2007

4.14: Shipment share of Top 5 VoIP Chip vendors in 2007

4.15: Revenue share of Top 5 Optical Networking Chip vendors in 2007

4.16: Shipment share of Top 5 Optical Networking Chip vendors in 2007

4.17: Revenue share of Top 5 General Networking vendors in 2007

4.18: Shipment share of Top 5 General Networking vendors in 2007

5.1: Analog Devices performance indicators 2007

5.2: Broadcom performance indicators 2007

5.3: Cavium performance indicators 2007

5.4: Conexant performance indicators 2007

5.5: Freescale performance indicators 2007

5.6: Ikanos performance indicators 2007

5.7: Infineon performance indicators 2007

5.8: Integrated Device Technology performance indicators 2007

5.9: Intersil performance indicators 2007

5.10: Lattice Semiconductors performance indicators 2007

5.11: LSI performance indicators 2007

5.12: Marvell performance indicators 2007

5.13: Maxim IC performance indicators 2007

5.14: Mindspeed performance indicators 2007

5.15: NXP performance indicators 2007

5.16: PMC-Sierra performance indicators 2007

5.17: Qualcomm performance indicators 2007

5.18: Silicon Labs performance indicators 2007

5.19: Texas Instruments performance indicators 2007

5.20: Zarlink Semiconductor performance indicators 2007

Tables

1.1: Revenues and Shipments in Communication Chips Market in 2007.

4.1: Revenues and Shipments of Top 5 Broadband Chips vendors in 2007

4.2: Revenues and Shipments of Top 5 Wireless Chips vendors in 2007

4.3: Revenues and Shipments of Top 5 Cellular Chips vendors in 2007

4.4: Revenues and Shipments of Top 5 VoIP Chips vendors in 2007

4.5: Revenues and Shipments of Top 5 Optical Networking Chips vendors in 2007

4.6: Revenues and Shipments of Top 5 General Networking Chips vendors in 2007

List of Companies Covered

Allegro Microsystems, Altera, AMCC, Analog Devices, Atmel, Broadcom, Broadlight, Centillium, Conexant, CSR, Dalsemiconductors, DSP Group, Entropic, Fortmedia, Freescale, Ikanos, Infineon, Integrated Device Technology, Intersil, Kawasaki-Micro, Lattice Semiconductors, Linear Technolgies, LSI, Marvell, Maxim IC, Metalink, Micrel, Microchip Technology, Micron Technology, Microsemi, Mindspeed, NeoMagic, Nordic Semiconductor, NXP, Parrot S.A., PMC-Sierra, Powerchip Semiconductor, Qualcomm, Quellan, Rabbit Semiconductor, Realtek, Renesas Technology, Samsung Electronics (Semiconductor division), Semtech, Sequans, SiGe, Silicon Laboratories, Silicon Optix, Sirenza, SmartCode Corp., SMIC, Spirit DSP, STMicrosystems, Sychip, Tarari, Teknovus, Texas Instruments, Transwitch, Triquint, TSMC, Western Design Center, Wintegra, WolfSon, Xilinx, Zarlink, ZiLOG